Our most popular blade.
Our hubless resinoid blade has been the industry standard for over 20 years
Our hubless resinoid blades are for dicing hard, brittle and highly crystallographic materials for over 20 years. This blade performs extremely well on materials such as glass, ceramic, sapphire and quartz.
In the resinoid blade the diamond abrasives are held securely in a resin bond. As the cutting edges of the diamonds become dull the stresses on the bond increase to the point where the diamond is dislodged. When this happens a new diamond is exposed with fresh cutting edges. This “self sharpening” effect permits consistent cutting performance with minimal chipping and superior surface finish.
We can also supply these blades with our unique stress relieved slots (see picture). These slots are designed to reduce the contact between the blade and the substrate. This reduces the load and contributes to the cooling of both the blade and the substrate. The slots also do a better job of cleaning the dicing residue from the kerf. The stress relief is provided by a circular cut out at the bottom of the slot. This cutout spreads the stress over a larger area which mitigates one of the primary failure mechanisms of standard slotted blades. These slots are available only on blades that are .008″ thick or thicker.
Since this is a hubless blade the user must have an appropriate set of flanges to allow mounting of the blade on the dicing saw.
- Minimum chipping, superior finish
- Time tested design
- Widely used in production environments
- Used on glass, ceramic, sapphire, and quartz
Permanently mounted. Easy to maintain.
Our hubBED resinoid blade reduces vibration and chipping
Because it is permanently mounted to its own hub there is no need to buy expensive flanges. Unlike flanges, once the blade is dressed, it can be removed and reinstalled without going through the dressing process. The lightweight aluminum hub reduces vibration and chipping.
Our hubbed resinoid blades, referred to as our type “CA”, are designed to be discarded after the blade has been consumed. This resin bond blade provides a superior surface finish and is used for glass, ceramic, sapphire, quartz, and other similar materials.
- Blades are permanently bonded to hub
- Dress only once
- Permanent hub reduces vibration and chipping
- Each blade permanently labeled with its distinct specification
- Used to cut glass, ceramic, sapphire, quartz
The standard of the silicon dicing world for decades.
Thin blade. Good wear rate. Great cut quality.
The nickel bond dicing blade has been the mainstay of the silicon dicing world for decades. This type of ultra-thin blade is created using a special electrodepositing technique to hold the cutting diamonds in a nickel alloy matrix. This results in a blade that can be made very thin with good wear rate and good cut quality.
Unlike standard nickel bond dicing blades, our blades are reinforced with single crystal silicon carbide whiskers. This increases its tensile and bend strength creating much better cut quality and wear rate with a very consistent kerf width. This increased rigidity also improves blade performance in applications where large exposures are required.
- Creates very thin kerfs: <50 microns
- Excellent cut quality with low wear rate
- Can handle high exposure to width ratios
- Used to cut silicon and III-V materials
Runs cooler. Lasts longer.
Our blades are laser cut and come in slotted and non-slotted formats
Sintered Blades have been created by capturing diamonds in a metal binder using a sintering process. This creates blades with very high rigidity and very low wear rates. Because of this rigidity, a sintered blade has the ability to create very straight cuts even when subjected to large exposures. It also means these blades will last for a very long time.
The slotted versions of these blades are especially good at singulating BGA and QFN packages. Non-slotted blades have a tendency to smear the soft metals in these packages which will cause shorting between the layers.
We can supply both slotted and non-slotted formats.
Slots allow more cooling water to get down into the kerf which means the blade will run cooler and last longer. Slots also expedite removal of debris from the bottom of the kerf. Unlike regular slotted blades our slots are manufactured with stress reliefs. The stress reliefs show up as a circular cutout in the bottom of each slot. This spreads the stress over a larger area which mitigates one of the primary failure mechanisms of non stress relieved slotted blades.
Rather than using a standard punch process, the cutting edge of our blades, along with the slots are produced using a Synova Laser Water Jet. This creates a blade that has a very symmetrical profile. This means that the blade requires less dressing to get it to run true. It also means that changes in the bulk material along the cutting edge are minimized which leads to more consistent cuts.
Materials that can be cut are FR4, green ceramic, BGA and QFN packages.
- Very rigid blades
- Very low wear rates
- Laser cut with Synova laser water jet
- Stress relieved slots
- Used to cut FR4, green ceramic, BGA & QFN packages
With over 100 years of combined experience, we are here to help.
We have the accessories you need to get the job done
Even though the dicing blade is a critical part of the dicing process there are many other requirements needed to successfully complete a dicing project.
Since we have over a 100 years of combined experience in the dicing world we can certainly give you advice on how to accessorize your project.
We have various tapes and mounting rings. We can ship small quantities of tape in precut squares. This eliminates the need to purchase a full roll of tape just to cut a few wafers.
If you prefer, we can mount the tape on the mounting ring and ship it to you as an assembly. All you have to do is to peel off the protective backing and apply the tape/hoop assembly to your wafer and you are ready to dice. If you are cutting very thick material or require very clean cuts, you might prefer to use a thermal bonding agent to securely attach the wafer to be cut to another wafer. A thermal bonding agent is simply a plastic that melts at a relatively low temperature. It then cools into a glass like state which results in a very secure bond. We have two different types of this material.
The primary tool used to prep the blade is the dressing board. Dressing boards are rectangular wafers made of an abrasive material that’s used to prepare the blade for cutting. A brand new blade must be used on a dressing board to reveal the diamonds and to eliminate any runout. This process is known as dressing the blade.
To minimize the problem of silicon dust on the surface of the wafer after the die separation process a non-ionic surfactant can be used. We can supply this water soluble solution to you in containers of various sizes. For a production environment we can also supply an Automatic Dispensing system that can inject the fluid directly into the DI water stream.
We can supply various types of items to be used in the shipping process. Everything from plastic containers (cookie jars), to clamshells to end pieces for coin roll shipments.