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Even though the dicing blade is a critical part of the dicing process
there are many other requirements needed to successfully complete a dicing project.
Since we have over a 100 years of combined experience in the dicing world we can
certainly give you advice on how to accessorize your project.
- Wafer Prep
We have various tapes and mounting rings. We can ship small quantities
of tape in precut squares. This eliminates the need to purchase a full
roll of tape just to cut a few wafers.
If you prefer, we can mount the tape on the mounting ring and ship it
to you as an assembly. All you have to do is to peel off the protective
backing and apply the tape/hoop assembly to your wafer and you are
ready to dice.
If you are cutting very thick material or require very clean cuts, you might
prefer to use a thermal bonding agent to securely attach the wafer to be cut
to another wafer. A thermal bonding agent is simply a plastic that melts at
a relatively low temperature. It then cools into a glass like state which
results in a very secure bond. We have two different types of this material.
- Blade Prep
The primary tool used to prep the blade is the dressing board.
Dressing boards are rectangular wafers made of an abrasive material that's
used to prepare the blade for cutting. A brand new blade must be used on a
dressing board to reveal the diamonds and to eliminate any runout. This
process is known as dressing the blade.
- During Dicing
To minimize the problem of silicon dust on the surface of the wafer after the
die separation process a non-ionic surfactant can be used. We can supply this
water soluble solution to you in containers of various sizes. For a production
environment we can also supply an Automatic Dispensing system that can inject
the fluid directly into the DI water stream.
- Shipping
We can supply various types of items to be used in the shipping process.
Everything from plastic containers (cookie jars), to clamshells to end pieces
for coin roll shipments.
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