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- Creates very thin kerfs, <50 microns
- Excellent cut quality with low wear rate
- Can handle high exposure to width ratios
- Used to cut Silicon and III-V materials
The Nickel Bond dicing blade has been the mainstay of the silicon dicing world for decades.
This type of ultra-thin blade is created using a special electrodepositing technique to hold
the cutting diamonds in a nickel alloy matrix. This results in a blade that can be made
very thin with good wear rate and good cut quality.
Unlike standard Nickel Bond dicing blades, our blades are reinforced with Single
Crystal Silicon Carbide Whiskers. This increases its tensile and bend strength
creating much better cut quality and wear rate with a very consistent kerf width.
This increased rigidity also improves blade performance in applications where large
exposures are required.
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